1.5 Ton Wheel Loader,Telescopic Wheel Loader,Wheeled Backhoe Loader,Small Payloader Sichuan Everest Lovol Construction Machinery Co,.LTD , https://www.everestlovol.com
The development of each industry must go through the process of start-up, development, maturity, and recession. Of course, the LED industry is no exception. It is in the period of industry development, and it must be the same quality and good quality. The essence and the dross coexist, and the market competition is becoming increasingly hot. If LED companies want to break through the butterfly, they must go to the truth and constantly innovate the core technology; LED companies that lack core technology innovations are getting worse and worse, and mastering cutting-edge technology is conducive to the company's invincible position. Looking back on 2013, the entire LED technology market continues to innovate, frequently appearing new technology and new hot keywords. EMC, flip chip, flip-chip, package-free, etc. set off the climax of the technology market.
EMC packaging EMC Chinese name is epoxy molding compound, also known as epoxy molding compound, and is one of the main raw materials in IC (Integrated Circuit) packaging manufacturing. With the development of IC packaging technology, EMC has also developed rapidly as a major electronic packaging material. With its high reliability, low cost, simple production process and suitable for large-scale production, EMC occupies more than 97% of the entire microelectronic packaging materials market. Now, EMC is expanding its reach into various packaging fields such as semiconductor devices, integrated circuits, consumer electronics, automotive, military, and aerospace. EMC offers an excellent solution for LED packaging applications due to its excellent heat resistance and suitable for large-scale modern production.
EMC is a highly integrated frame form using Molding equipment in modified Epoxy materials and etching technology. Etching copper substrates allows Epoxy to have a larger contact area with copper substrate holders, and is comparable to thermoplastics such as PPA. The strong adhesion makes EMC products unique in terms of moisture resistance and red ink penetration. The package is derived from the IC package but is different from the IC package. Due to changes in materials and structures, EMC products have high heat resistance, UV resistance, high integration, high current consumption, and small size. In particular, the significant improvement in anti-UV performance has led to a significant expansion of EMC product applications, which can cope with the harsh environment of outdoor lighting and automotive lighting, and will have a favorable impact on mature high-end ceramic packaging products.
EMC has attracted much attention for its high heat resistance. In pursuit of high cost performance, it has become a consensus in the LED industry for overcurrent use. However, the use of overcurrent is also a risk and opportunity. The biggest risk is the heat treatment. At present, the general EMC packaging process in the industry is: using medium-sized, vertical-structured, low-power chips, low-thermal-conducting insulating adhesives as chip bonding adhesives, and then welding wires, powders, and cuttings to achieve finished products.
EMC (EpoxyMoldingCompound, thermosetting epoxy resin) not only drives the supply of Taiwan's LED factory Jingdian, Yiguang, Ronda, Dongbei, the new century, the third quarter of this year, but also allows Taiwanese factories in the mainland lighting market. Compared with American Cree.
When the mainland lighting factory is looking for alternative materials, EMC's concept as a package bracket has become an excellent choice for cost-effectiveness. With the rapid introduction of related lead frames, chips and packaged products by Taiwan's LED-related supply chain manufacturers, and successfully shipped, Effectively reduce the cost of a single lighting product by 2 to 50%, and this wave of EMC is expected to become the mainstream technology of mainland lighting factories in the second half of the year.
The flip-chip flip chip is called flip-chip compared to the traditional wire bonding method (WireBonding) and post-balling process. Conventionally, the electronic surface of the wafer connected to the substrate by metal wire bonding is facing upward, and the electrical surface of the flip chip is facing downward, which is equivalent to turning the former over, so it is called a flip chip.
The essence of flip chip is that on the basis of the traditional process, when the light-emitting area and the electrode area of ​​the chip are not designed in the same plane, the electrode area is mounted toward the bottom of the lamp cup, and the process of soldering the wire can be omitted. However, the precision of the process of solid crystal is high, and it is generally difficult to achieve a high yield.
Advantages: A GaN-based LED structure layer is grown on a sapphire substrate by MOCVD technology, and light emitted from the P/N junction light-emitting region is emitted through the upper P-type region. Due to the poor conductivity of P-type GaN, in order to obtain good current expansion, a metal electrode layer composed of Ni-Au is formed on the surface of the P region by evaporation. The lead of the P region is taken up through the metal film of the layer. To achieve good current spreading, the Ni-Au metal electrode layer should not be too thin. For this reason, the luminous efficiency of the device is greatly affected, and it is usually necessary to take into account both the current expansion and the light extraction efficiency. However, in any case, the presence of the metal film always deteriorates the light transmission performance. In addition, the presence of wire bond pads also affects the light extraction efficiency of the device. The structure using GaN LED flip chip can fundamentally eliminate the above problem.
Due to the need for high-power commercial lighting to develop in the direction of high current, high brightness and multi-integration, there are some inevitable disadvantages such as gold wire soldering chip and vertical chip packaging technology, such as gold wire soldering, surge impact, and resistance. The problem of insufficient flow capacity, thermal expansion and contraction of the encapsulated silica gel causes the gold wire to break, and the gold wire affects the yield in the process.
Dr. Chen Zhengyan from the New Century R&D Center of Packaging-Free Technology said that the package-free technology is only the integration of technology, rather than letting the package disappear, basically packaging. As far as he is concerned, as long as it is a blue light phosphor, the process of realizing white light is packaging. As for why the package-free technology in the market is sizzling, Dr. Chen said that because of the elimination of some links in the package, it is the technology that can make the cost the lowest.
In PFC package-free products, the flipchip-based chip design does not require wire bonding. The advantage of PFC package-free wafer products is that the light efficiency is improved to 200lm/W, and the ultra-wide-angle full-period design with an illumination angle greater than 300 degrees can be used. The use of secondary optical lenses will reduce the wear and cost of light efficiency.
PFC new products will focus on the LED lighting market. Especially when applied to candle lamps, it can not only simulate the shape of tungsten lamps, but also break through the limitation of heat dissipation volume, and replace the traditional 40W tungsten candle lamp to achieve 3.5W with 350lm output.
The flip chip technology flip chip technology refers to a space formed by a wafer, a substrate, and a bump, and the circuit structure is encapsulated in this space. The packaged chip has the advantages of small size, high performance, and short connection.
Although flip chip technology has a compound annual growth rate of 19, it is not a new technology. It was first introduced to the market by IBM 30 years ago. Because of this, flip chip package is easy to be regarded as an old one. Unattractive mature technology.
In fact, no matter which packaging technology is used, the process phase of bumping is still needed. In 2012, bump technology accounted for 81 installations in the middle-end process, with approximately 14 million wafers in 12-inch wafers; wafer fab loading rates were also high, especially for copper pillar platforms (Cupillarplatform, 88). .
Eutectic eutectic refers to the phenomenon of eutectic fusion of eutectic solder at relatively low temperatures. The eutectic alloy changes directly from solid to liquid without passing through the plastic phase. It is a liquid state that simultaneously produces two solid states. Balance the reaction. Its melting temperature is called the eutectic temperature.
The most critical of eutectic soldering technology is the choice of eutectic materials and the control of soldering temperature. For eutectic soldering, alloys such as pure tin (Sn) or gold-tin (Au-Sn) may be used as the contact surface coating on the bottom of the crystal grains, and the crystal grains may be soldered on the substrate coated with gold or silver. When the substrate is heated to a suitable eutectic temperature, gold or silver elements penetrate into the gold-tin alloy layer, the composition of the alloy layer changes to increase the melting point, the eutectic layer is cured and the LED is soldered to the heat sink or substrate. . The eutectic layer and the heat sink or the substrate are completely bonded together, breaking the thermal bottleneck in the heat dissipation system from the chip to the substrate, and improving the life of the LED.
Although this technology was previously adopted by large manufacturers, the usual chip structure is not suitable for eutectic technology because it is a sapphire substrate. However, by 2013, the number of chip solutions accompanying non-sapphire substrates increased, and the high-power chip manufacturers using sapphire substrates introduced more flip-chip chips, making eutectic technology an option for Chinese packaging manufacturers to enhance their technological competitiveness. . Therefore, many manufacturers such as Ruifeng, Tiandian and so on spared no expense to purchase expensive eutectic solid crystal equipment.
There is a powerful pusher behind the modularized cottage machine that is the integrated module launched by MTK. Although this counterattack finally ended with the wisdom of the machine. However, the essence of this business model still has a lot to learn from. Because of the modular integration, product design and manufacturing are once again divided, the industry chain is once again elongated, manufacturers do not have to bear the cost and risk of design failure, and excellent product design operators do not have to bear the risk of commercialization of terminal products. As a result, many small companies that compete and cooperate also have the power to compete with large companies that are systematically integrated.
An LED lighting fixture, from design, material selection, testing, certification to final delivery, is costly and has a long cycle. Often, there are already more competitive products in the process market after a project has been completed. Many costly new products and new designs have not yet had time to recover the cost and will be delisted. In the current situation of more intense competition and more difficult survival, small enterprises often have the power to chase after facing new products of competitors. They can only choose to stick to old products or plagiarize.
The visionary industry thinks of LED modularization, the most influential of which belongs to the Zhaga Alliance. The alliance is currently the most internationally recognized LED light engine interchangeability (Interchangeability) interface standard, aiming at promoting the standardization of global LED lighting system interface, and thus achieving compatibility and interchangeability between different manufacturers' products to ensure Consumers' interest in buying. In fact, although Zhaga was initiated by the nine leading manufacturers, it now has 190 members worldwide, and its popularity is evident.
For the lighting industry, the design of the luminaire becomes simple. Lighting manufacturers only need to focus on the final whole lamp or luminaire manufacturing. As long as the luminaire is compatible with Zhaga's interface, the luminaire design is compressed from a complex optomechanical thermal system project to a simple assembly process. Manufacturers can spend more energy and resources on production management and marketing. At least in this way, at least in the design of the core components, small manufacturers have the opportunity to stand on the same platform as the big manufacturers.
In 2013, we saw GE, Addison, Qiqi Optoelectronics, Bridgelux many large and small manufacturers have joined the zhaga camp, modularization, module standardization trend has been irreversible.
to sum up:
With the LED lighting market taking off and the LED specifications for backlights changing, the mid-power market has become the mainstream specification for the LED industry in 2013. The output value surpasses the high-power market for the first time. EMC and Flip-Chip products rise with the mid-power market. It became the shining star of 2013. The introduction of new technologies has undoubtedly accelerated the development of the LED industry and promoted the popularity of LEDs.